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圖片 | 型號(hào) | 品牌 | 數(shù)量 | 封裝 | 批號(hào) | 備注 |
MSP430F2003IPWR | TI | 41000 | TSSOP14 | 2031+ | ROHS DataSheet | |
AM3354BZCZ60 IC | TI | 4255 | BGA | 2031+ | ROHS DataSheet | |
M430F149 | TI | 7580 | QFP | 2031+ | ROHS DataSheet | |
TPS54010MPWPREP | TI | 7742 | SMD/SOIC | 2031+ | ROHS DataSheet | |
LM3S811-IQN50-C1 | TI | 7580 | QFP | 2031+ | ROHS DataSheet | |
M430F2131 | TI | 4700 | SOP20 | 2031+ | ROHS DataSheet | |
M430F147IPW | TI | 2750 | LQFP64 | 20+ | ROHS DataSheet | |
LM3S9C97-IBZ80-A2 | TI | 7120 | BGA | 2031+ | ROHS DataSheet | |
INA128HD | TI | 2750 | SMD/SOIC | 2031+ | ROHS DataSheet | |
UCD9222WRGZREP IC | TI | 7120 | SMD/SOIC | 2031+ | ROHS DataSheet | |
UCC2802MDREP IC | TI | 7580 | SMD/SOIC | 2031+ | ROHS DataSheet | |
AM3359BZCZD80 | TI | 4700 | BGA | 2031+ | ROHS DataSheet | |
TLV2548MPWREP | TI | 2750 | SMD/SOIC | 2031+ | ROHS DataSheet | |
MAX3232MDBREP | TI | 3200 | SMD/SOIC | 2031+ | ROHS DataSheet | |
AM3357BZCZA60 | TI | 4255 | BGA | 2031+ | ROHS DataSheet | |
TFP201APZP | TI | 2750 | QFP | 2031+ | ROHS DataSheet | |
6PAIC3109TWRHMRQ1 | TI | 3200 | SMD/SOIC | 2031+ | ROHS DataSheet | |
CLVCH16T245MDGGREP | TI | 4700 | SMD/SOIC | 2031+ | ROHS DataSheet | |
TSB41BA3DIPFP | TI | 3200 | QFP | 2031+ | ROHS DataSheet | |
AM3352BZCZD60 | TI | 4255 | BGA | 2031+ | ROHS DataSheet | |
M430F47177 | TI | 2750 | QFP | 2031+ | ROHS DataSheet | |
ADS8509HDB IC | TI | 4700 | SMD/SOIC | 2031+ | ROHS DataSheet | |
MAX14653EWC+T IC | TI | 4255 | 2031+ | ROHS DataSheet | ||
M430F135 | TI | 5000 | QFP | 2031+ | ROHS DataSheet |